Methods of operating microelectronic devices, and methods of providing microelectronic devices

ABSTRACT

Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices are described. In one embodiment, a microelectronic device includes a microelectronic package which provides a housing within which integrated circuitry is received. An integrated circuit die is received within the microelectronic package and includes integrated circuitry formed thereon. The integrated circuitry comprises first transmit/receive circuitry configured to transmit and receive radio frequency signals. Second transmit/receive circuitry is provided, discrete from the first transmit/receive circuitry, and is contained within the microelectronic package. The second circuitry is configured to transmit and receive radio frequency signals, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package. In another embodiment, a microelectronic package is provided having housed therein integrated circuitry. Wireless communication is produced using a transmitter inside the microelectronic package. The produced wireless communication is received using a receiver inside the microelectronic package. Responsive to the receiving of such communication, the integrated circuitry is caused to operate in a designed manner.

CROSS REFERENCE TO RELATED PATENT DATA

[0001] This is a continuation of U.S. patent application Ser. No.10/371,123, filed Feb. 19, 2003, which in turn is a continuation of U.S.patent application Ser. No. 09/260,997, filed Mar. 1, 1999, now U.S.Pat. No. 6,542,720 B1, and incorporated herein by reference.

TECHNICAL FIELD

[0002] This invention pertains to microelectronic devices, to methods ofoperating microelectronic devices, and to methods of formingmicroelectronic devices.

BACKGROUND OF THE INVENTION

[0003] As semiconductor integrated circuit (IC) devices continue toshrink in dimension, challenges are posed with respect to packaging theintegrated circuitry into microelectronic devices. In some prior artintegrated circuitry device, individual IC chips (die) are connected toinner leads of a lead frame by wire bonds. The chip, wire bonds, andinner leads are completely encapsulated for protection with a substancesuch as plastic or ceramic. Outer leads communicate with the inner leadsof the lead frame, but the outer leads typically remain exposed formounting of the packaged device to external circuitry, such as a printedcircuit board. Exemplary constructions are disclosed in U.S. Pat. Nos.5,734,198, 5,736,783, 5,763,945, 5,818,105 5,117,068, and 5,692,298, thedisclosures of which are incorporated by reference herein.

[0004] In a conventional construction, a semiconductor die is placed onand bonded to a center die paddle of a lead frame for support. Innerlead fingers of the lead frame are disposed proximate the paddle but donot contact or communicate with the paddle. Rather, wire bondscommunicate between contact pads (terminals) on the die and the innerlead fingers of the lead frame by spanning a gap between the die and thefingers. The wire bonds allow for the transmission of electrical signalsbetween the die and the lead frame. The lead fingers allow the chip ordie to be electrically connected with other chips or die for providingan operable microelectronic device.

[0005] Wire bonds can be problematic for a number of different reasons.First, additional processing steps are needed to ensure that the wirebonds are adequately formed between the lead frame and bond pads on theintegrated circuit die. Such processing requires precise placement ofthe wire bonds or the operation of the integrated circuit die can becompromised. Additionally, because wire bonds are typically very thinelectrical connections they can become disconnected and causeoperational failure of the finished device.

[0006] Accordingly, this invention arose out of concerns associated withproviding improved microelectronic devices and methods of forming thesame which reduce processing complexities and provide for improvedperformance.

SUMMARY OF THE INVENTION

[0007] Microelectronic devices, methods of operating microelectronicdevices, and methods of forming microelectronic devices are described.In one embodiment, a microelectronic device includes a microelectronicpackage which provides a housing within which integrated circuitry isreceived. An integrated circuit die is received within themicroelectronic package and includes integrated circuitry formedthereon. The integrated circuitry comprises first transmit/receivecircuitry configured to transmit and receive radio frequency signals.Second transmit/receive circuitry is provided, discrete from the firsttransmit/receive circuitry, and is contained within the microelectronicpackage. The second circuitry is configured to transmit and receiveradio frequency signals, wherein the first and second transmit/receivecircuitry are configured to establish wireless communication between oneanother within the microelectronic package. In another embodiment, amicroelectronic package is provided having housed therein integratedcircuitry. Wireless communication is produced using a transmitter insidethe microelectronic package. The produced wireless communication isreceived using a receiver inside the microelectronic package. Responsiveto the receiving of such communication, the integrated circuitry iscaused to operate in a designed manner.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

[0009]FIG. 1 is a side elevational view of a microelectronic device inaccordance with one embodiment of the invention, with a portion havingbeen broken away for clarity.

[0010]FIG. 2 is a top plan view of a portion of a microelectronic devicein accordance with one embodiment of the invention.

[0011]FIG. 3 is a top plan view of a portion of a microelectronic devicein accordance with one embodiment of the invention.

[0012]FIG. 4 is a high level block diagram of an integrated circuit diein accordance with one embodiment of the invention.

[0013]FIG. 5 is a high level block diagram of a microelectronic devicein accordance with one embodiment of the invention.

[0014]FIG. 6 is a flow diagram which describes one embodiment of thepresent invention.

[0015]FIG. 7 is a flow diagram which describes one embodiment of thepresent invention.

[0016]FIG. 8 is a flow diagram which describes one embodiment of thepresent invention.

[0017]FIG. 9 is a side elevational view of a microelectronic device inaccordance with one embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] This disclosure of the invention is submitted in furtherance ofthe constitutional purposes of the U.S. Patent Laws “to promote theprogress of science and useful arts” (Article 1, Section 8).

[0019] Referring to FIGS. 1-5, and particularly to FIG. 1, an exemplarymicroelectronic device in accordance with one embodiment of theinvention is shown generally at 10. The term “microelectronic device” asused in this document will be understood to include, without limitation,integrated circuit devices which are resident on a single die or chip,or a collection of die or chips arranged into an operable integratedcircuit configuration. Device 10 includes a microelectronic package 12which provides a housing within which integrated circuitry is received.The term “microelectronic package” will be understood to mean a housingor container within which integrated circuitry is received to provide amicroelectronic device. By way of example only, example microelectronicpackages include product containers such as computer hard drivehousings, cellular phone housings, and other hand-held electronic devicehousings. Such microelectronic packages need not, however, be hand-held.In addition, microelectronic packages can include self-containedhermetically-sealed packages such as those which conventionally containintegrated circuit die. Such packages can be formed from plastic,ceramic, or any other suitable material.

[0020] In FIG. 1, a portion of package 12 has been broken away forclarity. An integrated circuit die 14 is received within microelectronicpackage 12 and has integrated circuitry formed thereon. In this example,package 12 includes individual die 16, 18, 20, and 22 which have beenprepackaged into individual respective integrated circuit chips whichcontain integrated circuitry which can be or is electrically connectedinto an operative arrangement.

[0021] In FIG. 2, a top plan view of die 14, 16 is shown. The dashedlines which bound the individual die are intended to represent theexterior of a die or chip container. In a preferred embodiment, one ofthe integrated circuit die, e.g. die 14, includes integrated circuitry24 (FIG. 4) having first transmit/receive circuitry 26 configured totransmit and receive radio frequency signals. Second transmit/receivecircuitry (such as circuitry 26) is provided which is preferablydiscrete from first transmit/receive circuitry 26. Such secondtransmit/receive circuitry can be received or supported by die 16.Accordingly, the second transmit/receive circuitry is contained withinmicroelectronic package 12 and is configured to transmit and receiveradio frequency signals.

[0022] In a preferred embodiment, the first and second transmit/receivecircuitry 26 are configured to establish wireless communication betweenone another within the microelectronic package. In one embodiment,second transmit/receive circuitry (such as circuitry 26 b in FIG. 5) isdisposed on a second integrated circuit die such as die 14 b. In anotherembodiment, the microelectronic device further includes a substrate 30(FIGS. 1 and 2) disposed within the housing and supporting the first andsecond transmit/receive circuitry 26. Any suitable material can be usedfor substrate 30 with exemplary substrates including a printed circuitboard.

[0023] In one embodiment, microelectronic devices can be provided whichare small in size, such as those which can be hand-carried ortransported. In another embodiment, the integrated circuitry comprisingthe first and second transmit/receive circuitry 26 are disposed within24 inches of one another (distance d in FIG. 2) within themicroelectronic package. In another embodiment (FIGS. 3-5), integratedcircuitry 24 comprising the first and second transmit/receive circuitry26 respectively, comprise individual respective antennas 32 (FIG. 5)which are configured to transmit and receive wireless communication. Theantennas can be connected to their respective integrated circuitry 24 bya conductive trace of material (indicated as a dashed line extendingbetween integrated circuitry 24 and antenna 32 in FIG. 3) over the die.Further augmentation can be provided by connecting the antenna to a leadfinger, similar to lead fingers 34, 36 (FIG. 3) via a wire bond. In apreferred embodiment, the antennas are configured to transmit andreceive wireless RF communication.

[0024] In one embodiment, antennas 32 (FIG. 5) are disposed within 24inches of one another within the microelectronic package. In anotherembodiment, the antennas are disposed within one inch of one anotherwithin the microelectronic package. In yet another embodiment, theantennas are disposed within one-half inch of one another within themicroelectronic package.

[0025] In one embodiment, and one perhaps best shown in FIG. 3, die 14is void of external electrical connections for anything other than atleast one of power and ground. In the illustrated example, lead fingers34, 36 are provided and are coupled electrically with die 14 via wirebonds 38, 40 respectively. The wire bonds connect with contact pads 42,44 respectively on die 14 and provide the connections through whichpower and ground are established. These connections, in this example,constitute the only connections which are necessarily made through leadfingers to the outside world. Of course, other connections can be madethrough lead fingers which are not specifically illustrated.

[0026] Referring still to FIGS. 1-5, and in accordance with anotherembodiment, an integrated circuit die 14 is received withinmicroelectronic package 12 and has integrated circuitry 24 thereon whichis configured to operate in a designed manner. By “designed manner” ismeant any manner in which integrated circuitry is conventionally able tooperate. In this example, integrated circuitry 24 includes a processor46 (FIG. 4), 46 a, 46 b (FIG. 5). Processor 46 can comprise any suitablyformed or provided processor, e.g. a microprocessor, which isconventionally employed in integrated circuitry devices. FIG. 4 alsoshows integrated circuitry 24 as including a receiver/transmitter 26.Although this element is shown as a combination receiver/transmitter, itcan comprise only a receiver or only a transmitter.

[0027]FIG. 5 shows an exemplary device which comprises two die 14 a, 14b. These die are preferably part of and received inside ofmicroelectronic package 12. An integrated circuitry transmitter 26 a isprovided and received within microelectronic package 12. The transmittercan, but need not have a companion receiver. The transmitter ispreferably configured to transmit wireless communication. An integratedcircuitry receiver 26 b is provided and is received withinmicroelectronic package 12. The receiver can, but need not have acompanion transmitter. Receiver 26 b is preferably configured to receivewireless communication which is transmitted by integrated circuitrytransmitter 26 a. In a preferred embodiment, receiver 26 b is operablycoupled with a processor 46 b and configured to provide data to theprocessor responsive to received wireless communication. In oneembodiment, receiver 26 b comprises a portion of the integratedcircuitry which is formed on die 14 b. In another embodiment, integratedcircuitry transmitter 26 a is disposed on a second integrated circuitdie. In another embodiment, more than one die is received within thehousing, as shown best in FIG. 1. The plurality of die all may or maynot be configured to communicate with one another.

[0028] Preferably, die 14 a, 14 b are configured in some applications toestablish wireless communication between them in a manner which servesto eliminate most, if not all physical-electrical connections which wereformerly employed to establish wireless communication therebetween. Forexample, and as prevalent in the prior art, individual die wereconnected, via suitable wire bonds, to lead frames which, in turn,established electrical communication with the outside world. Inaccordance with some of the inventive structures and methods, many ofthe wire bonds and lead fingers on the lead frames can be eliminatedbecause now, functional communication between the separate die takesplace through the transmission of wireless communication. Of course, insome embodiments, physical-electrical connection can be provided inorder to supply desired die with suitable power and ground connections.

[0029] In one embodiment, the transmitter and the receiver are disposedwithin the microelectronic package within 24 inches of one another. Inanother embodiment, the transmitter and the receiver are disposed withinthe microelectronic package within one inch of one another. In anotherembodiment, the transmitter and receiver are disposed within themicroelectronic package within one-half inch of one another.

[0030] Preferably, processor 46 is configured to receive data which isprovided by receiver 26 and, responsive thereto, cause the integratedcircuitry on die 14 to operate in the above-mentioned designed manner.In a preferred embodiment, the microelectronic device 10 ishand-transportable.

[0031] Referring still to FIGS. 1-5, and in accordance with anotherembodiment of the invention, a microelectronic device includes amicroelectronic package 12 which provides a housing within whichintegrated circuitry is received. The microelectronic package preferablyincludes an integrated circuitry-supporting substrate 30 inside thehousing. An integrated circuit die, e.g. any and/or all of die 14-22, isreceived within package 12 and supported by substrate 30. The diepreferably has integrated circuitry formed thereon comprising firsttransmit/receive circuitry 26 a (FIG. 5) configured to transmit andreceive wireless communication. Second transmit/receive circuitry 26 bis provided and is preferably discrete from first transmit/receivecircuitry 26 a. The second transmit/receive circuitry 26 b is preferablycontained within microelectronic package 12 and is configured totransmit and receive wireless communication. In this example, the firstand second transmit/receive circuitry 26 a, 26 b are configured toestablish wireless communication between one another within themicroelectronic package 12 sufficient to enable the integrated circuitryon die 14 to operate in a designed manner. In one embodiment, the secondtransmit/receive circuitry is supported by the integratedcircuit-supporting substrate 30. In another embodiment, the secondtransmit/receive circuitry 26 b is disposed on a second integratedcircuit die supported by the integrated circuitry-supporting substrate30. In another embodiment, device 10 is hand-transportable.

[0032] In another embodiment, individual antennas 32 (FIG. 5) areprovided and are operably associated with the first and secondtransmit/receive circuitry 26 a, 26 b respectively. In one embodiment,the antennas are disposed within 24 inches of one another. In anotherembodiment, the antennas are disposed within one inch of one another. Inyet another embodiment, the antennas are disposed within one-half inchof one another.

[0033] Referring to FIG. 6, and in accordance with another embodiment ofthe invention, a method of operating a microelectronic device is showngenerally at 100 and includes at 102, providing a microelectronicpackage having housed therein integrated circuitry. At 104, wirelesscommunication is produced using a transmitter inside of themicroelectronic package. At 106, the produced wireless communication isreceived using a receiver inside the microelectronic package. At 108,and responsive to the receiving of the wireless communication, theintegrated circuitry within the microelectronic package is caused tooperate in a designed manner. In one embodiment, the production ofwireless communication at 104 takes place through the use of anintegrated circuitry transmitter. In another embodiment, the receipt ofsuch wireless communication takes place through the use of an integratedcircuitry receiver. Other embodiments further comprise positioning thetransmitter and the receiver inside the microelectronic package within24 inches, one inch, and one-half inch respectively, of one another. Inyet another embodiment, provision of the integrated circuitry within themicroelectronic package comprises fabricating the circuitry.

[0034] Referring to FIG. 7, and in accordance with another embodiment ofthe invention, a method of operating a microelectronic device is showngenerally at 200 and includes, at 202, providing a microelectronicpackage having housed therein integrated circuitry. At 204, a wirelesscommunication signal is transmitted using an integrated circuitrytransmitter inside the microelectronic package. At 206, the transmittedwireless communication signal is received using an integrated circuitryreceiver inside the microelectronic package. At 208, and responsive toreceiving the wireless communication signal, the integrated circuitrywithin the microelectronic package is caused to operate in a designedmanner. In one embodiment, the transmitter and the receiver arepositioned within 24 inches of one another. In other embodiments, thetransmitter and the receiver are positioned within one inch and one-halfinch respectively, of one another. Further aspects of the inventioninclude fabricating one of the integrated circuitry transmitter orreceiver, or preferably both.

[0035] Referring to FIG. 8, and in accordance with another embodiment ofthe invention, a method of providing a microelectronic device is showngenerally at 300 and includes at 302 providing a microelectronic packagewithin which integrated circuitry is to be housed. At 304, an integratedcircuitry transmitter is mounted within the package. At 306, anintegrated circuit die is mounted within the package and includesintegrated circuitry disposed thereon. The integrated circuitrypreferably includes an integrated circuit receiver, wherein thetransmitter and the receiver are configured to establish direct wirelesscommunication with one another. Preferably, the wireless communicationpermits operating instructions for the integrated circuitry on the dieto be transmitted and received within the microelectronic package. Inone embodiment, the transmitter and the receiver are mounted within 24inches of one another. In another embodiment the transmitter and thereceiver are mounted within one inch of one another. In yet anotherembodiment, the transmitter and the receiver are mounted within one-halfinch of one another.

[0036] Referring to FIG. 9, an exemplary microelectronic device is showngenerally at 50 and includes a microelectronic package 52. Package 52contains and supports an integrated circuit die 54. Physical-electricalconnection structure is provided and shown generally at 56, and securesdie 54 to an integrated circuitry-supporting substrate 58. Thephysical-electrical connection structure provides both electrical andphysical connections between circuit die 54 and outside world circuitry.In this embodiment, physical-electrical connection structure 56 supplieselectrical connections only for power and ground. In this specificexample, the physical-electrical connection structure includesrespective wire bonds 60, 62 which are individually and respectivelyconnected with lead fingers 64, 66.

[0037] Advantages of various embodiments of the invention include areduction in the number wire bonds necessary to impart functionality toa microelectronic device. Relatedly, the number of processing stepswhich are needed to ensure that wire bonds are adequately formed betweena lead frame and bond pads on an integrated circuit die can be reduced.Hence, risks which were formerly associated with wire bonds becomingdetached because of the very thin nature of such connections can bereduced. Various embodiments of the invention can provide improvedmicroelectronic devices and methods of forming the same which reduceprocessing complexities and provide for improved performance.

[0038] In compliance with the statute, the invention has been describedin language more or less specific as to structural and methodicalfeatures. It is to be understood, however, that the invention is notlimited to the specific features shown and described, since the meansherein disclosed comprise preferred forms of putting the invention intoeffect. The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

1. A method comprising: disposing an integrated circuit die within amicroelectronic package, the integrated circuit die having integratedcircuitry formed thereon, the integrated circuitry including firsttransponder circuitry configured to transmit and receive radio frequencysignals; and disposing second transponder circuitry, discrete from thefirst transponder circuitry, within the microelectronic package, thesecond transponder circuitry being configured to transmit and receiveradio frequency signals, wherein the first and second transpondercircuitry are configured to establish wireless communication between oneanother within the microelectronic package.
 2. The method of claim 1,and comprising disposing more than one die in the microelectronicpackage.
 3. The method of claim 1, and further comprising disposing thesecond transponder circuitry on a second integrated circuit die.
 4. Themethod of claim 1, and further comprising disposing a substrate withinthe housing, and supporting the first and second transponder circuitrysupported on the substrate.
 5. The method of claim 1, and furthercomprising disposing a printed circuit board substrate within thehousing, and supporting the first and second transponder circuitry onthe printed circuit board substrate.
 6. The method of claim 1, whereinthe microelectronic package is sized to be hand-carriable.
 7. The methodof claim 1, and further comprising disposing the first and secondtransponder circuitry within 24 inches of one another within themicroelectronic package.
 8. The method of claim 1, wherein the first andsecond transponder circuitry comprise individual respective antennasconfigured to transmit and receive wireless communications.
 9. Themethod of claim 1, wherein the first and second transponder circuitrycomprise individual respective antennas configured to transmit andreceive wireless RF communications.
 10. The method of claim 1, whereinthe first and second transponder circuitry comprise individualrespective antennas configured to transmit and receive the wirelesscommunication, the method further comprising disposing the antennaswithin 24 inches of one another within the microelectronic package. 11.The method of claim 1, wherein the first and second transpondercircuitry comprise individual respective antennas configured to transmitand receive wireless communication, the method further comprisingdisposing the antennas within one inch of one another within themicroelectronic package.
 12. The method of claim 1, wherein the firstand second transponder circuitry comprise individual respective antennasconfigured to transmit and receive wireless communication, the methodfurther comprising disposing the antennas within one half inch of oneanother within the microelectronic package.
 13. A method comprising:disposing an integrated circuit die within a microelectronic package andsupporting the die by an integrated circuitry-supporting substrateinside the package, the integrated circuit die having integratedcircuitry formed thereon, the integrated circuitry having firsttransponder circuitry configured to transmit and receive wirelesscommunications, the integrated circuit die having physical-electricalconnection structure securing it to the integrated circuitry-supportingsubstrate; disposing second transponder circuitry, discrete from thefirst transponder circuitry, within the package, the second transpondercircuitry being configured to transmit and receive wirelesscommunications; and causing the first and second transponder circuitryto establish wireless communications between one another within themicroelectronic package.
 14. The method of claim 13, wherein thewireless communication comprises RF communication.
 15. The method ofclaim 13, and further comprising disposing the second transpondercircuitry on a second integrated circuit die supported by the integratedcircuitry-supporting substrate.
 16. The method of claim 13, and furthercomprising supporting the second transponder circuitry by the integratedcircuitry-supporting substrate.
 17. The method of claim 13, wherein thepackage is sized to be hand-transportable.
 18. The method of claim 13,and further comprising operably associating individual antennas with thefirst and second transponder circuitry respectively, and disposing theantennas within the microelectronic package within 24 inches of oneanother.
 19. The method of claim 13, further comprising operablyassociating individual antennas with the first and second transpondercircuitry respectively, and disposing the antennas within themicroelectronic package within one inch of one another.
 20. The methodof claim 13, further comprising operably associating individual antennaswith the first and second transponder circuitry respectively, anddisposing the antennas within the microelectronic package within onehalf inch of one another.
 21. The method of claim 13, and furthercomprising hermetically sealing the package.
 22. A method of operating amicroelectronic device comprising: mounting a transmitter integratedcircuit within a microelectronic package, wherein the transmitterintegrated circuit is void of external electrical connections foranything except power supply external connections; mounting anintegrated circuit receiver within the package; transmitting a wirelesscommunication using the transmitter; receiving the produced wirelesscommunication using the receiver inside the microelectronic package; andresponsive to said receiving, causing integrated circuitry separate fromthe transmitter and receiver to operate.
 23. The method of claim 22further comprising positioning the transmitter and the receiver within24 inches of one another.
 24. The method of claim 22 further comprisingpositioning the transmitter and the receiver within one inch of oneanother.
 25. The method of claim 22 further comprising positioning thetransmitter and the receiver within one half inch of one another. 26.The method of claim 22 further comprising fabricating the integratedcircuitry.
 27. A method of operating a microelectronic devicecomprising: transmitting a wireless communication signal using anintegrated circuitry transmitter inside a microelectronic package, thetransmitter being void of external electrical connections other thanpower supply external electrical connections; receiving the transmittedwireless communication signal using an integrated circuitry receiverinside the microelectronic package; and responsive to said receiving,causing the integrated circuitry within the microelectronic package tooperate.
 28. The method of claim 27 further comprising positioning thetransmitter and the receiver within 24 inches of one another.
 29. Themethod of claim 27 further comprising positioning the transmitter andthe receiver within one inch of one another.
 30. The method of claim 27further comprising positioning the transmitter and the receiver withinone half inch of one another.
 31. The method of claim 27 furthercomprising fabricating one of the integrated circuitry transmitter orreceiver.
 32. A method of forming a microelectronic device comprising:mounting an integrated circuitry transmitter within a microelectronicpackage; and mounting an integrated circuit die within the package,wherein the integrated circuit die has physical-electrical connectionstructure securing it within the package, said structure supplyingelectrical connections for, at most, power supply, the die havingintegrated circuitry disposed thereon including an integrated circuitreceiver, wherein the transmitter and receiver are configured toestablish direct wireless communication with one another, whereinoperating instructions for the integrated circuitry on the die aretransmitted and received within the microelectronic package.
 33. Themethod of claim 32, wherein the transmitter and the receiver are mountedwithin 24 inches of one another.
 34. The method of claim 32, wherein thetransmitter and the receiver are mounted within one inch of one another.35. The method of claim 32, wherein the transmitter and the receiver aremounted within one half inch of one another.